MACS.Researching

INTRODUCTION my paper

2010-03-16T15:56:00.001-07:00

In modern digital communication systems useful information, not to change the parameters of the frequency signal (as in analog systems), and in the fact of the presence or absence of a signal. This distortion parameters of discrete signals during propagation in the medium and in the equipment have little effect on their employment and discrimination. This digital system provides much higher accuracy of processing, transformation and transmission of information.
Wide application of automatic control systems of technological production lines, onboard equipment and organization of reliable information exchange over long distances between objects led to the establishment of information channels of communication, in which the transfer of necessary information is provided by intermodule exchange.
There are modules of processing and transmission of information, who have the opportunity after the transfer of the analog signal into digital form to encrypt it to some algorithm, and when receiving an encrypted signal to decode it, and then translated into analog form. Thus, even if the transmitted signal is intercepted, it can not be decrypted without knowing the encryption algorithm. Messages are encrypted to prevent the introduction of false information.
Increase accuracy and noise immunity, additional security features are accompanied by increased dimensions and weight, as the number of components of digital systems is much more than analog. Growing and the cost of such equipment. It is possible and negative changes: reduction of resistance to external influences (eg, vibration loads) and robustness (an important factor for the responsible use of equipment). These circumstances relate to electronic devices (ED) with a somewhat obsolete component framework based on the traditionally-mounted components.
Obviously, the higher the degree of integration and the smaller size of the components used, the better the design and technological, economic and operational characteristics of ED as a whole.
Therefore, in this thesis aims to improve the functionality, design and technology and reliability characteristics, as well as the dimensions and weight cell IMCO.
Relevance of topics related to development and research of new retrofit design cell IMCO and assembly technology of its production, satisfying the modern requirements for ACS.
To achieve this goal should be to solve the following tasks:
- Analyze the functional characteristics and structure of the cell MMCE;
- Reasonably choose a new component base of the cell;
- Develop design printed circuit board with the choice of a promising component base;
- Develop and analyze the design of the cell MMCE;
- Simulate the strength and thermal characteristics of the cell MMCE;
- Perform a preliminary assessment of the reliability of IMCO, taking into account possible applications;
- To develop the technological process (TP), high-precision assembly and installation plotnoukomponovannoy cell MMCE;
- Assess the manufacturability of designs developed by the cell MMCE.
Scientific novelty of the paper is as follows:
- Reasonably selected software for modeling the most important characteristics of the construction of the cell;
- Theoretical modeling of strength properties and their optimization for the design of the cell MMCE;
- Analysis of simulation results to obtain semigraphical dependencies and developed recommendations for designing cell MMCE;
- The theoretical principles to the assessment of structural integrity of cell MMCE;
- Preliminary estimation of the reliability of the cell MMCE.
The practical significance of the work:
- Modeling results used in the development of construction components and cell MMCE in general;
- Developed a trace of the PCB for cell IMCO and its assembly drawing using software Mentor Graphics;
- Choose the method and means of implementing a high-precision assembly and installation of cell MMCE;
- Developed recommendations to ensure the necessary heat treatment;
- Developed an algorithm for the main stages of technological process (TP) assembly and installation of cell IMCO with a view to ensuring their quality and reliability of technological means;
- Estimated manufacturability design developed cell MMCE.
(MMCE = module multi-channel exchange )

MATLAB E book collection

2010-02-22T13:56:00.000-08:00

MATLAB - The Language Of Technical Computing

MATLAB® is a high-level language and interactive environment that enables you to perform computationally intensive tasks faster than with traditional programming languages such as C, C++, and Fortran. And then use for
Computer modeling and analysis. I want to share by all of
my member, whose need to researching and want to know
about this language .I uploaded not only Myanmar Mallab Ebook and English Matlab E book ,all of book I collected from another persond and internet. Will hope it is useful for my friends. Thank for all..At down u can download E book with medirafire .

Introduction Matlab
Basic Matlab Tutorial
Matlab myanmar Ebook

Type the rest of your post here.

E learning at youtube

2009-12-03T12:38:00.000-08:00

NPTER LECTURE

Module MO MKO အစိတ္အပုိင္းအေၾကာင္း

2009-11-03T15:28:00.001-08:00

ဒီ component cell ေလးကေတာ့ multiplex channel လမ္းေၾကာင္းေပၚမွာရွိတဲ့ logical-protocol terminal device ေတြကုိတည္ေဆာက္ဖုိ႔ရာအတြက္နဲ႔ သီးၿခားၿပင္ပ Voltage လမ္းေၾကာင္းေတြကုိခ်ိန္းေပးႏုိင္တဲ့deviceေပၚမွာ
ဆက္သြယ္မႈ႔လမ္းေၾကာင္း MKO (အဓိက ႏွင့္ သိမ္းဆည္းမႈ)မွ လက္ခံၿခင္းလြင့္ေပးၿခင္းအခ်က္ၿပမ်ားကုိအသုံးၿပဳရန္ အတြက္သုံးပါတယ္..။ PI ေခၚ အၿပိဳင္ၾကားခံဆက္သြယ္ၿခင္းစနစ္ ေပၚမွာရွိတဲ့ External device ေတြနဲ႔အတူ exchange လုပ္ႏဳုိင္ပါတယယ္…။

မိမိေလ့လာေနရတဲ့ Circuit Module အစိတ္အပုိင္းတစ္ခုအေၾကာင္းကို ေဖာ္ၿပၿခင္းပါ..။
Automatic Control System ႏွင့္အတူ အသုံးၿပဳဖုိ႔အတြက္ ဒီပစၥည္းေလးကို ထုတ္လုပ္ၿခင္းပါ
တစ္ေနရာနဲ႔ တစ္ေနရာ ဆက္သြယ္ရန္.. Singnal, information မ်ားေပးပို႔ရန္အတြက္..
ဒီၾကားခံပစၥည္းေလးက အေထာက္အပံ့ေပးႏုိင္ပါတယ္..
အထဲမွာ ထည့္သြင္းအသုံးၿပဳရမဲ့ Component ( Resistor,Diod,etc...)
ေတြကုိ သာမန္တည္ေဆာက္လုိ႔မရဘဲ အပူခ်ိန္ -50 နဲ႔ +50 အတြင္းခံႏုိင္ေအာင္ တည္ေဆာက္ထားရပါမယ္
ေနာက္ပုိင္းမွာ စာတမ္းအတြက္လုိအပ္တဲ့ ပညာရပ္ေတြအေၾကာင္းကို ထည့္သြင္းေဖာ္ၿပေပးပါမယ္..။

English လုိပါေဖာ္ၿပေပးလုိက္ပါတယ္..

Designed for the formation of a logical-protocol terminal device on the highway multiplex channel input and output signals to external isolation transformers of the transmission line information ICE (main and backup) .MKO can exchange with external devices on parallel interface PI.

Specifications

Temperature of minus 50 ° C to + 50 ° C
Power consumption 0,3 W
Supply Voltage 5 ± 0,5 In
Dimensions 50,5 h36, 4x5, 0 mm
Weight 0,04 kg

External Interfaces

Channel information exchange ICE GOST 26765.52-87 (formats 1,2, 4, mode terminal devices), duplicate 1
Channel exchange on the parallel interface
Bus width of data 16
Address bus width 10
External clock frequency of 8 MHz

E book collection

2009-09-15T14:47:00.000-07:00

Micro electronic

for document searching MACs

2009-09-15T14:22:00.000-07:00

http://www.tpub.com/content/neets/14178/
http://www.microelectronica.ru/index.html
http://toe-rgr.ru/load/22-1-0-99

About of pro/engineering

2008-11-20T15:52:00.000-08:00

ProE ဆိုတဲ႔ Pro Engineering သည္ ၃ ဖက္ျမင္ဒီဇိုင္းေတြ ေရးဆြဲရာမွာ လြယ္ကူလ်င္ျမန္တဲ႔ Application တစ္ခုပါ။
ProE မွာ ဒီဇိုင္းဆြဲလို႔ ထြက္လာတဲ႔ Model ကို finite element analysis လုပ္ဖုိ႔ အတြက္ computer-aided engineering (CAE) တစ္ခုျဖစ္တဲ႔Ansys ထဲမွာ ထည္႔သြင္းတြက္ခ်က္ရန္အတြက္ပါ။
ProE ထဲမွာပဲ တစ္ခါတည္းတြက္ခ်က္နုိင္ေပမယ္႔ FEM result ကို စိတ္မခ်တဲ႔ အတြက္Ansys ထဲမွာပဲ ထည္႔သြင္းတြက္ခ်က္ၾကတယ္လို႔ ကၽြန္ေတာ္ထင္ပါတယ္။
ProE နဲ႔ပတ္သက္ျပီး ဆရာတစ္ဆူမဟုတ္ေသးသလို သင္ယူေလ႔လာဆဲေက်ာင္းသားအဆင္႔သာျဖစ္ပါသည္။

Microelectronics

2008-11-20T11:27:00.001-08:00

Microelectronics is a subfield of electronics. Microelectronics, as the name suggests, is related to the study and manufacture, or microfabrication, of electronic components which are very small (usually micrometre-scale or smaller, but not always). These devices are made from semiconductors. Many components of normal electronic design are available in microelectronic equivalent: transistors, capacitors, inductors, resistors, diodes and of course insulators and conductors can all be found in microelectronic devices.

Digital integrated circuits (ICs) consist mostly of transistors. Analog circuits commonly contain resistors and capacitors as well. Inductors are used in some high frequency analog circuits, but tend to occupy large chip area if used at low frequencies; gyrators can replace them in many applications.

As techniques improve, the scale of microelectronic components continues to decrease. At smaller scales, the relative impact of intrinsic circuit properties such as interconnections may become more significant. These are called parasitic effects, and the goal of the microelectronics design engineer is to find ways to compensate for or to minimize these effects, while always delivering smaller, faster, and cheaper devices.

pro/Engineer လင့္မ်ား

2008-10-07T14:37:00.001-07:00

http://www.me.cmu.edu/academics/courses/NSF_Edu_Proj/Wildfire_short_course/tutorials.htm

http://www-h.eng.cam.ac.uk/help/amb/programs/mecad/proewildfire.html